DUFU TECHNOLOGY CORP. BHD
(Bursa: 7233)

Dufu Technology Corp. Bhd. is an investment holding company, which engages in the manufacture of precision machining parts and components. The firm serves the hard disk drives, industry safety and sensor, telecommunication, consumer electronics, and medical and office equipment industries. It operates through the following geographical segments: Malaysia, Singapore, China, Thailand, and Others. The company was founded by Chin Shui Hsu and Hui Ta Lee in October 1987 and is headquartered in Bayan Lepas, Malaysia.

1.310 s

-0.040 (-2.96%)
价格区间 1.310 - 1.370   (4.58%)
开盘 1.370
昨收 1.350
1.310
买盘 ('00) 784
1.320
卖盘 ('00) 732
成交量 ('00) 16,965
成交额 2,265,391
注释 s
数据延迟。最后一次更新02 Apr 2026 12:29.
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Dividend

除权日 28 May 2026
登记日 29 May 2026
支付日 15 June 2026
Final Dividend MYR 0.02

AGM

会议日期 07 May 2026
会议时间 10:00 AM
10:00 am at Jadeite Room, Level 4, Amari SPICE, No. 2 Persiaran Mahsuri, 11900 Penang.
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