DUFU TECHNOLOGY CORP. BHD
(Bursa: 7233)

The Group is principally involved in investment holding and providing management services, design, develop, manufacture, assemble and trade of die components and precision machining of vice, computer peripherals and parts, for hard disk drive and etc.

2.110 [c] s

+0.030 (+1.44%)
价格区间 2.070 - 2.140   (3.38%)
开盘 2.090
昨收 2.080
2.100
买盘 ('00) 109
2.120
卖盘 ('00) 50
成交量 ('00) 23,832
成交额 5,008,382
注释 [c] s
数据延迟。最后一次更新26 Apr 2024 17:31.
数据提供商

未来大事

Dividend

除权日 29 May 2024
登记日 30 May 2024
支付日 14 June 2024
Single Tier Final Dividend of 2 sen per share for the year ended 31 December 2023

AGM

会议日期 08 May 2024
会议时间 9:00 AM
Jadeite Room, Level 5 at Amari SPICE, No. 2 Persiaran Mahsuri, 11900, Penang, Malaysia Malaysia
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