Mi Technovation Berhad is in the business of R&D and manufacturing of die sorting machines for advanced packaging such as WLP, WLCSP, FOWLP, CSP for flip chip. Its solutions are used in telecommunication industry (5G market) for smartphones, tablets and wireless wearable devices as well as IoT industry solutions that require high functionality, mobility and low power consumption small form factor devices. Hengshuo Technology is part of the material division of MI Technovation Group, focusing on the manufacture and research and development of high-end solder balls.