Kulicke & Soffa Industries, Inc.
(NASDAQ: KLIC)

Kulicke and Soffa Industries, Inc. (K&S) designs, manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits (IC), high and low powered discrete devices, light-emitting diodes (LEDs), and power modules. It also service, maintain, repair and upgrade its equipment. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers (OSATs), other electronics manufacturers and automotive electronics suppliers. The Company operates two segments: Equipment and Expendable Tools. The Equipment Segment manufactures and sells a line of balls bonders, heavy wire wedge bonders, wafer level bonders, and die bonders that are sold to semiconductor device manufacturers, OSATs, other electronics manufacturers and automotive electronics suppliers. Expendable Tools Segment manufactures and sells a variety of expendable tools for ranges of semiconductor packaging applications.

58.397 -

+0.057 (+0.10%)
Range 57.000 - 59.170   (3.81%)
Open 58.760
Previous Close 58.340
Bid Price 58.320
Bid Volume 1
Ask Price 58.360
Ask Volume 7
Volume 366,943
Value 16,825,042
Remark -
Delayed prices. Updated at 30 Jan 2026 03:45.
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About Kulicke & Soffa Inds

Kulicke and Soffa Industries, Inc. (K&S) designs, manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits (IC), high and low powered discrete devices, light-emitting diodes (LEDs), and power modules. It also service, maintain, repair and upgrade its equipment. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers (OSATs), other electronics manufacturers and automotive electronics suppliers. The Company operates two segments: Equipment and Expendable Tools. The Equipment Segment manufactures and sells a line of balls bonders, heavy wire wedge bonders, wafer level bonders, and die bonders that are sold to semiconductor device manufacturers, OSATs, other electronics manufacturers and automotive electronics suppliers. Expendable Tools Segment manufactures and sells a variety of expendable tools for ranges of semiconductor packaging applications.

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