Kulicke & Soffa Industries, Inc.
(NASDAQ: KLIC)

Kulicke and Soffa Industries, Inc. (K&S) designs, manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits (IC), high and low powered discrete devices, light-emitting diodes (LEDs), and power modules. It also service, maintain, repair and upgrade its equipment. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers (OSATs), other electronics manufacturers and automotive electronics suppliers. The Company operates two segments: Equipment and Expendable Tools. The Equipment Segment manufactures and sells a line of balls bonders, heavy wire wedge bonders, wafer level bonders, and die bonders that are sold to semiconductor device manufacturers, OSATs, other electronics manufacturers and automotive electronics suppliers. Expendable Tools Segment manufactures and sells a variety of expendable tools for ranges of semiconductor packaging applications.

102.640 -

+0.140 (+0.14%)
Range 96.460 - 109.500   (13.52%)
Open 105.190
Previous Close 102.500
Bid Price 100.650
Bid Volume 19
Ask Price 104.670
Ask Volume 19
Volume 658,980
Value 51,908,124
Remark -
Delayed prices. Updated at 10 Jun 2026 04:10.
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About Kulicke & Soffa Inds

Kulicke and Soffa Industries, Inc. (K&S) designs, manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits (IC), high and low powered discrete devices, light-emitting diodes (LEDs), and power modules. It also service, maintain, repair and upgrade its equipment. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers (OSATs), other electronics manufacturers and automotive electronics suppliers. The Company operates two segments: Equipment and Expendable Tools. The Equipment Segment manufactures and sells a line of balls bonders, heavy wire wedge bonders, wafer level bonders, and die bonders that are sold to semiconductor device manufacturers, OSATs, other electronics manufacturers and automotive electronics suppliers. Expendable Tools Segment manufactures and sells a variety of expendable tools for ranges of semiconductor packaging applications.

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