DUFU TECHNOLOGY CORP. BHD
(Bursa: 7233)

The Group is principally involved in investment holding and providing management services, design, develop, manufacture, assemble and trade of die components and precision machining of vice, computer peripherals and parts, for hard disk drive and etc.

2.080 [c] s

-0.060 (-2.80%)
Range 2.070 - 2.130   (2.90%)
Open 2.130
Previous Close 2.140
Bid Price 2.070
Bid Volume ('00) 101
Ask Price 2.090
Ask Volume ('00) 188
Volume ('00) 40,282
Value 8,462,235
Remark [c] s
Delayed prices. Updated at 25 Apr 2024 17:31.
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Dividend

Ex-Date 29 May 2024
Record Date 30 May 2024
Payable Date 14 June 2024
Single Tier Final Dividend of 2 sen per share for the year ended 31 December 2023

AGM

Meeting Date 08 May 2024
Meeting Time 9:00 AM
Jadeite Room, Level 5 at Amari SPICE, No. 2 Persiaran Mahsuri, 11900, Penang, Malaysia Malaysia
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