(Bursa: 5286)

Mi Technovation Berhad is in the business of R&D and manufacturing of die sorting machines for advanced packaging such as WLP, WLCSP, FOWLP, CSP for flip chip. Its solutions are used in telecommunication industry (5G market) for smartphones, tablets and wireless wearable devices as well as IoT industry solutions that require high functionality, mobility and low power consumption small form factor devices. Hengshuo Technology is part of the material division of MI Technovation Group, focusing on the manufacture and research and development of high-end solder balls.

1.910 s

+0.020 (+1.06%)
Range 1.890 - 1.940   (2.65%)
Open 1.900
Previous Close 1.890
Bid Price 1.900
Bid Volume ('00) 130
Ask Price 1.920
Ask Volume ('00) 200
Volume ('00) 20,512
Value 3,935,109
Remark s
Delayed prices. Updated at 12 Apr 2024 17:31.
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