Kulicke & Soffa Industries, Inc.
(NASDAQ: KLIC)

Kulicke and Soffa Industries, Inc. (K&S) designs, manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits (IC), high and low powered discrete devices, light-emitting diodes (LEDs), and power modules. It also service, maintain, repair and upgrade its equipment. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers (OSATs), other electronics manufacturers and automotive electronics suppliers. The Company operates two segments: Equipment and Expendable Tools. The Equipment Segment manufactures and sells a line of balls bonders, heavy wire wedge bonders, wafer level bonders, and die bonders that are sold to semiconductor device manufacturers, OSATs, other electronics manufacturers and automotive electronics suppliers. Expendable Tools Segment manufactures and sells a variety of expendable tools for ranges of semiconductor packaging applications.

66.280 -

+0.560 (+0.85%)
Jarak 66.040 - 68.190   (3.26%)
Buka 66.360
Tutup Terdahulu 65.720
Harga Beli -
Beli Purata -
Jual Beli -
Purata Jual -
Purata 399,646
Nilai 24,526,358
Catatan -
Harga tertunda. Dikemas kini pada 02 Apr 2026 08:00.
Data dikuasakan oleh
Lihat Semua Acara

Mengenai Kulicke & Soffa Inds

Kulicke and Soffa Industries, Inc. (K&S) designs, manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits (IC), high and low powered discrete devices, light-emitting diodes (LEDs), and power modules. It also service, maintain, repair and upgrade its equipment. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers (OSATs), other electronics manufacturers and automotive electronics suppliers. The Company operates two segments: Equipment and Expendable Tools. The Equipment Segment manufactures and sells a line of balls bonders, heavy wire wedge bonders, wafer level bonders, and die bonders that are sold to semiconductor device manufacturers, OSATs, other electronics manufacturers and automotive electronics suppliers. Expendable Tools Segment manufactures and sells a variety of expendable tools for ranges of semiconductor packaging applications.

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